Aluminium Scandium Nitride Films

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Aluminium Scandium Nitride Films

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In a recent study, researchers from the Tokyo Institute of Technology (Tokyo Tech) discovered that aluminium scandium nitride (AlScN) ferroelectric films remain stable and maintain their properties at temperatures up to 600°C. 

This stability makes them highly promising for next-generation ferroelectric memory devices.

 

Ferroelectric Materials for Next-Generation Memory

  • They have the potential to store gigabytes of data in thin films, ideal for storing movies, video games, and videos.
  • These materials have unique ion arrangements that allow two stable polarisation states, similar to 0 and 1 in binary code, for digital data storage.
  • Advantages:
  • Non-volatile: They retain data without power.
  • Efficient Switching: They use a small electric field for fast data writing and reading, leading to low energy consumption.
  • Challenges: Existing materials like Pb(Zr,Ti)O3 (PZT) and SrBi2Ta2O9, degrade during high-temperature fabrication with hydrogen.

 

 

Aluminium Scandium Nitride Films

 

Key Highlights:

  • AlScN films maintain high stability of ferroelectric properties after heat treatment in an H₂-included atmosphere, regardless of electrode material.
  • Two crucial factors for ferroelectric materials used in memory devices are remnant polarisation (Pr) and coercive field (Ec). 
    • Pr signifies the amount of polarisation retained after the electric field is removed, while Ec represents the electric field required to switch the material’s polarisation state.
  • High Remanent Polarisation: A higher Pr (>100 µC/cm²) compared to PZT (30–50 µC/cm²), indicating a stronger ability to retain data.
  • Stable Coercive Field: Ec of AlScN films increased only slightly (by about 9%) after heat treatment. This small change suggests minimal impact on the energy required for data switching.
  • Superior Stability: Unlike other materials, its strong aluminium-nitrogen bond prevents hydrogen from entering the film, preserving stability during fabrication with hydrogen.
  • With these characteristics, AlScN films are a strong candidate for next-gen ferroelectric memory devices.

 

Working Principle

  • Researchers deposited (Al0.8Sc0.2)N film on a silicon substrate using sputtering at 400°C.
  • Films were placed between platinum (Pt) and titanium nitride (TiN) electrodes.
  • Pt encourages hydrogen incorporation; TiN acts as a barrier to H2 diffusion.
  • Experimental Conditions: Films underwent post-heat-treatment in hydrogen and argon atmosphere at 400 to 600°C for 30 minutes at 800 Torr.
  • X-ray diffraction (XRD) examined crystal structure changes.
  • Positive-up-negative-down (PUND) measurements evaluated Pr and Ec.
    • Pr remained stable above 120 µC/cm² much higher than HfO2-based films and PZT.
    • Ec increased only slightly, attributed to changes in the film’s crystal lattice constant.
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